叠板英文

* Process Module 说明 : A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料发料 (Panel)(Shear material to Size) B. 钻孔 (Drilling) b-1 内钻 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射钻孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔 (Blind & Buried Hole Drilling) C. 乾膜制程 ( Photo Process(D/F)) c-1 前处理 (Pretreatment) c-2 压 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 显 影 (Developing) c-5 蚀铜 (Etching) c-6 去膜 (Stripping) c-7 初检 ( Touch-up) c-8 化学前处理,化学研磨 ( Chemical Milling ) c-9 选择性浸金压膜 (Selective Gold Dry Film Lamination) c-10 显 影(Developing ) c-11 去膜(Stripping ) D. 压 合 Lamination d-1 黑 化 (Black Oxide Treatment) d-2 微 蚀 (Microetching) d-3 铆钉组合 (eyelet ) d-4 叠板 (Lay up) d-5 压 合 (Lamination) d-6 后处理 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 铣靶 (spot face) d-9 去溢胶 (resin flush removal)E. 减铜 (Copper Reduction) e-1 薄化铜(Copper Reduction) F. 电镀 (Horizontal Electrolytic Plating) f-1 水平电镀 (Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀 ( Tin-Lead Plating ) (Pattern Plating) f-3 低於 1 mil ( Less than 1 mil Thickness ) f-4 高於 1 mil ( More than 1 mil Thickness) f-5 砂带研磨 (Belt Sanding) f-6 剥锡铅 ( Tin-Lead Stripping) f-7 微切片 ( Microsection) G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 预烤 (Precure) g-3 表面刷磨 (Scrub) g-4 后烘烤 (Postcure) H. 防焊(绿漆): (Solder Mask) h-1 C面印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 静电喷涂 (Spray Coating) h-4 前处理 (Pretreatment) h-5 预烤 (Precure) h-6 曝光 (Exposure) h-7 显影 (Develop) h-8 后烘烤 (Postcure) h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 喷砂 ( Pumice)(Wet Blasting) h-12 印可剥离防焊 (Peelable Solder Mask) I . 镀金 Gold plating i-1 金手指镀镍金 ( Gold Finger ) i-2 电镀软金 (Soft Ni/Au Plating) i-3 浸镍金 ( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡 (Hot Air Solder Leveling) j-1 水平喷锡 (Horizontal Hot Air Solder Leveling) j-2 垂直喷锡 ( Vertical Hot Air Solder Leveling) j-3 超级焊锡 (Super Solder ) j-4. 印焊锡突点 (Solder Bump) K. 成型 (Profile)(Form) k-1 捞型 (N/C Routing ) (Milling) k-2 模具冲 (Punch) k-3 板面清洗烘烤 (Cleaning & Backing) k-4 V型槽 ( V-Cut)(V-Scoring) k-5 金手指斜边 ( Beveling of G/F) L. 短断路测试 (Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查 ( AOI Inspection) l-2 VRS 目检 (Verified & Repaired) l-3 泛用型治具测试 (Universal Tester) l-4 专用治具测试 (Dedicated Tester) l-5 飞针测试 (Flying Probe) M. 终检 ( Final Visual Inspection) m-1 压板翘 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-3 包装 及出货 (Packing & shipping)