duxingdejimi
Bumping, 一般是指在wafer晶圆表面做出铜锡或金凸点（英文就是bumping）从intel早起的CPU到现在苹果的AP处理器，都是先做bumping再和其他芯片一起做到PCB基板上成模块的想了解更多，点采纳吧
有星星的夜
BOAC,是一种焊垫设于有源电路上方焊接的集成电路结构，也叫“有源电路上凸点”。下面的英文段落供参考。A BOAC/COA of a semiconductor device is manufactured by forming a conductive pad over a semiconductor device, forming a passivation oxide film over the semiconductor device including the conductive pad, forming an oxide film over the entire surface of the conductive pad and the passivation oxide film, forming an oxide film pattern defining a bond pad region on the conductive pad, sequentially forming a barrier film and a metal seed layer over the oxide film pattern, the passivation oxide film and the conductive pad, forming a metal layer over the metal seed layer, planarizing the metal layer exposing the oxide film pattern and portions of the barrier film and the metal seed layer, and removing the oxide film pattern by an etching process.
